Adhesive bonding, potting and sealing processes are moving rapidly toward automated, inline solutions. In October 2026 industry professionals will gather in Stuttgart to assess technologies for joining and assembly.
Dates and venue for Bondexpo 2026
Bondexpo 2026 runs from 6 to 8 October in Stuttgart at the New Stuttgart Trade Fair Centre within Messe Stuttgart. The event runs in parallel with Motek and shares access and facilities, enabling visitors to attend multiple industrial fairs with a single ticket.
Who exhibits at Bondexpo 2026
The exhibition focuses on the joining process chain by adhesive bonding, potting, sealing and foaming. The available information records 409 exhibitors, reflecting a broad supply of adhesive manufacturers, dispensing and dosing equipment providers, assembly integrators and quality control solution makers.
Program and synergy with Motek
The trade fair program includes technical exhibition areas, process-oriented routes and content related to production automation. Bondexpo partners with the 43rd Motek to bring automation and assembly topics together. Information from the organizer also highlights the benefit of a single ticket that grants entry to up to six trade fairs at the Stuttgart Exhibition Center.
Key figures
- Exhibitors: 409.
- Edition: 18th Bondexpo, scheduled 6 to 8 October 2026 in Stuttgart.
Prospecting tactics for Bondexpo 2026
- Prioritize by process impact
- Target suppliers whose solutions reduce cost or defect rates in the specific joining steps you want to improve.
- Technical intake sheet
- Prepare a one-page spec with substrates, cycle times and required joint strength to get focused offers on site.
- Short, scheduled meetings
- Block 20-minute slots per supplier to compare offers and capture suppliers’ readiness for trials.
- On-site validation options
- Arrange for product demos or sample tests where possible. Seeing a dispenser or a curing process in action shortens evaluation time.
- Lead tagging and follow-up
- Use a uniform lead code system for post-fair technical evaluation and procurement decisions.
Final note and action
For manufacturing and automation buyers the combined Bondexpo and Motek setup facilitates comparing adhesive solutions within the full assembly chain. Arrive with technical priorities and a booked meeting plan to convert booth visits into procurement candidates. For tickets, hall plans and exhibitor lists consult the official site at http://www.bondexpo-messe.com and map your route through the Messe Stuttgart halls.
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